Products
TFE(Top Face Emitting)pixel package
Intrinsic Magnetization Filmy thermal Conductivity Technology
In order to manufacture high performance gas cylinder, Ingentec study many composite metal and found copper magnetic wafer (CMW) has the excellent character of permeability, heat dissipation and chemical slicing can be widely applied in high power red LED, Micro LED and as the substrate. It can improve the mass transfer yield, shorten the process time and increase the LED die brightness and electric saving. It also can be applied in VCSEL (Vertical-Cavity Surface-Emitting Laser) as the substrate to solve the problem of heat dissipation and increase the emission distance and die brightness. More application is under developed.
PRODUCT INFOMATION
- Product Description
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TFE(Top Face Emitting)pixel package
- Applications
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Huge Display for Semi-Outdoor.
- Feature
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Perfect light distribution
The existing 0404 pixel package is comprised by flip chip which caused light distribution might be offset and light reducing. Ingentec made the innovation and named it “0404 TFE pixel package”. Ingentec comprised 0404 TFE pixel package by vertical chip which could gain more brightness and perfect light distribution. Brightness of vertical chip is better than flip chip (same size), that mains we could gain more chip quantity in one epi wafer and reduce the manufacture cost of 0404 TFE pixel package.