TGV Glass Core

PRODUCT INFOMATION

Product Description

TGV Glass Core

Applications

Mini & Micro LED, 2.5 & 3D package for the semiconductor, MEMS, Bio Chips, 5G Chips

Feature

Item	Spec.
Glass type	alkali free glass
	Customized
Glass Thickness
	0.15um-1.0um
	Customized
Via Diameter	10um-200um
	Customized
Aspect Ratio	1:1-1:15
	Customized
Via Shapes	Straight
	Customized
Inside wall	Free of microcracks, chipping & induced stress
Via sife walls Ra	<1um
Substrate Size	50mm-180mm (Round/Square)
Positional Accuracy of Via	+/- 3um
Pattern/Via contact material	Silver Paste/Copper