Products
TransVivi Pixel®
Ingentec has invested in the research and development of TransVivi Pixel® technology for many years. The initial development originated from the process of developing new materials for specialty gas cylinders. It was discovered that composite materials with copper as the base material and magnetic permeability properties are suitable for use in μLEDs as carrier substrates. Ingentec calls this composite material CMW(Copper Magnetic Wafer). During the mass transfer process, the CMW(Copper Magnetic Wafer) substrate carries the light-emitting layer/EPI after cutting not only protects the light-emitting layer/EPI from damage, but also allows the die to be positioned quickly through magnetism, speeding up packaging efficiency, and ensure high yield throughout the entire process. In order to verify the feasibility of this unique technology, Ingentec has been collaborating with National Yang Ming Chiao Tung University since 2019 to conduct verification. By using CMW(Copper Magnetic Wafer) as the carrier substrate, Ingentec successfully developed CMμLED as the basic component packaged and led to the birth of TransVivi Pixel®.
In terms of LED structure, in the past, whether it was a Vertical or Face-up structure, or the later developed Flip-chip structure, the current conduction was through gold wire bonding. The structural excellence of TransVivi Pixel® is that it has a vertical structure and a non-wired film bonding current conduction package, which does not require gold wire bonding, not only achieves low cost, but also achieve high reliability of current conduction.
PRODUCT INFOMATION
- Product Description
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TransVivi Pixel®
- Applications
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The displays assembled by TransVivi Pixel® can be used in large displays such as conference rooms, commercial exhibition venues, Gaming centers, KTVs, and outdoor displays, as well as small displays for mobile devices such as outdoor payment piles and electric motorcycles. The TransVivi Pixel® is widely applied.
- Feature
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01
Power saving 30%
TransVivi Pixel® has high brightness and a large light-emitting area, and can save 30% of power.
02No color shift
The top surface of TransVivi Pixel® emits light, and under a white screen, it looks the same white at any angle.
03
Magnetic mass transfer with high yield
μLED red, blue, and green single-color packaging into pixels require the use of mass transfer technology. Because CMμLED is carried by a substrate, it can provide good protection for the red, blue, and green single-color light-emitting layers/EPI, not only ensuring that CMμLED high yield also ensures the high yield of TransVivi Pixel® in the post process.
04
Dual-sided display
Combining the TGV (Through Glass Via) process and advanced processes to shrink the grain size, TransVivi Pixel® can be assembled into a double-sided display, enriching its diverse applications.
05
High reliability
By using CMW (Copper Magnetic Wafer) as the carrier substrate to protect the light-emitting layer/EPI, and closely combining it with the light-emitting layer/EPI, the vertical structure and the non-wired thin film bonding current conduction package, TransVivi Pixel® can demonstrate high reliability.
06
Low cost
TransVivi Pixel® is the second-generation product developed by Ingentec. Improving the first generation TFE (Top Face Emitting Pixel) requires the higher cost of gold wire bonding. TransVivi Pixel® reduces costs through a thin film bonding packaging structure. Ingentec is working on this Develop micro-die sizes to achieve third-generation products with double-sided displays and fourth-generation products with ultra-high resolution.