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Home > Product > ReBirth Technology
重生技術

玻璃穿孔TGV (through Glass Via)

Application:
micro or mini LED 半導體2.5 & 3D 封裝/2.5 & 3D package for the semiconductor 微機電/MEMS 生物晶片/Bio Chips 5G Chips
Description:

光滑/無裂紋/無應力

Free of microcracks, chipping & induced stress

 

Item

Spec.

玻璃材料(Glass type)

無鹼玻璃/alkali free glass

Customized

玻璃厚度 (Glass Thickness)

100um-500um

Customized

通孔直徑 (Via Diameter)

10um-100um

Customized

徑深比 (Aspect Ratio)

1:1-1:10

Customized

通孔形狀 (Via Shapes):

直通/Straight

Customized

側壁形貌 (inside wall)

光滑/無裂紋/無應力
Free of microcracks, chipping & induced stress

基板尺寸 (Substrate Size)

100mm-400mm (Round/Square)

孔徑公差: (Positional Accuracy of Via)

+/- 3um

填孔材料/導線材料
(Pattern/Via contact material)

銀漿/Silver Paste

導線/填孔電阻
(Contact Resistant)

5×10-5   Ω·cm

 

 

Feature:
 

晶呈科技股份有限公司 Ingentec Corporation
35059苗栗縣竹南鎮公義路462巷58號  TEL : +886-37-585-218  FAX : +886-37-585-219 
No.58, Ln.462, Gongyi Rd., Zhunan Township, Miaoli County, Taiwan  Design by TENG